Dual applicator fluid dispensing methods and systems

ABSTRACT

Method of dispensing fluid are disclosed. The method initially determines, based upon an image of a first electronic substrate, that a first or a second dispense region is misaligned relative to the other of the first or the second dispense region. Fluid is dispensed from a first applicator while moving the first applicator using a primary positioner on the first electronic substrate to form a first fluid pattern. Fluid is simultaneously dispensed from a second applicator while moving the second applicator using the primary positioner and a secondary positioner. The method then determines, based upon an image of a second electronic substrate, that a first and a second dispense region of the second electronic substrate are aligned relative to one another. Fluid is simultaneously dispensed from the first applicator and the second applicator while moving the first applicator and the second applicator together using the primary positioner with first applicator.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/624,932, filed Jun. 16, 2017, and published as U.S. Patent App. Pub.No. 2017/0282207 on Oct. 5, 2017, which is a divisional of U.S. patentapplication Ser. No. 14/326,722, filed Jul. 9, 2014, and issued as U.S.Pat. No. 9,707,584 on Jul. 18, 2017, which are hereby incorporated byreference herein.

TECHNICAL FIELD

The present invention relates generally to dispensing viscous fluids,and more particularly to dispensing viscous fluids at multiple dispenseregions simultaneously with multiple fluid applicators.

BACKGROUND

In the manufacture of electronic substrates, such as printed circuitboards (“PCB”) for example, it is frequently necessary to apply small,precise amounts of viscous fluids, i.e., those with a viscosity greaterthan 50 centipoise. Such fluids may include adhesives, solder paste,solder flux, solder mask, underfill material, encapsulants, pottingcompounds, epoxies, die attach pastes, silicones, RTV, orcyanoacrylates, for example.

Automated fluid dispensing systems are often used for dispensingpatterns of such viscous fluids onto substrates with a high degree ofaccuracy, repeatability, and efficiency. As used herein, the term “fluidpattern,” and variations thereof, refers to one or more lines, arcs,dots, combinations thereof, and/or any other configuration ofcontinuously or intermittently dispensed fluid. Traditional fluiddispensing systems include a fluid applicator, also referred to as adispenser or valve, mounted to a gantry which is movable for positioningthe applicator as desired along three mutually orthogonal axes (X, Y, Z)above one or more substrates positioned generally in the horizontal XYplane. The gantry is generally movable with drive mechanisms controlledby a computer system or other controller. A moving conveyor, generallyaligned with the X axis of the dispensing system, may be used tosequentially deliver pluralities of substrates to a location generallybeneath a fluid dispensing system. The pluralities of substrates areoften organized into and carried by carrier trays, such as a JEDEC tray.The dispensing system may then be operated to dispense a pre-programmedpattern of fluid onto the substrates.

To dispense a pattern of fluid onto one or more substrates held in acarrier tray, the controller first determines the location andorientation of the substrates in the horizontally-oriented XY plane inwhich the substrates generally lie. A camera mounted to the gantry scansthe substrates and captures visual images of reference fiducialsprovided on the top surfaces of each substrate by traveling along a paththat moves across the pre-programmed locations of the referencefiducials which are known by the controller. Based on these capturedvisual images, the controller determines the actual location andorientation of each substrate in the XY plane. A height sensor, alsomounted to the gantry, measures the position of each substrate along thevertically-oriented Z axis for determining a proper dispense height atwhich a dispensing tip of the applicator should be positioned whendispensing onto the substrate. The controller then operates the gantryto move the applicator along the X and Y axes until the applicator isproperly positioned in the XY plane over a desired region of a substratepositioned below. The applicator is then lowered along the Z axis untilthe dispensing tip is at the proper dispensing height, at which pointthe applicator then dispenses the pre-programmed fluid pattern onto thesubstrate. Upon completion of dispensing, the applicator is then raisedback up along the Z axis and may be repositioned in the XY plane forsubsequent dispensing at a new region of the same substrate or of a newsubstrate.

For increased manufacturing throughput, fluid dispensing systems havebeen provided with dual fluid applicators for simultaneously dispensingat first and second dispense regions. As used herein, the term “dispenseregion” refers to a general region or zone at which a fluid pattern isdispensed. For example, “dispense region” may refer to a substrategenerally or it may refer to a particular region of a substrate.Accordingly, the phrase “first and second dispense regions,” andvariations thereof, may refer to first and second substrates that arephysically independent of each other, or alternatively it may refer tofirst and second distinct regions of a single substrate. For example, asingle substrate, such as a panelized substrate, may include a pluralityof distinct regions at which fluid is dispensed.

With traditional fluid dispensing systems, a first applicator ispositioned and controlled to dispense at a first dispense region, suchas a first substrate, while a second applicator is simultaneouslypositioned and controlled to dispense at a second dispense region, suchas a second substrate. On occasion, the first and second substrates maybe rotated in the same way in the XY plane of the dispensing system(i.e., “globally rotated”) relative to the X and Y axes. Global rotationof the substrates may occur when the carrier tray in which thesubstrates are carried is not aligned with the X and Y axes. Traditionaldual dispensing methods have included steps for making an automated,one-time positional adjustment of the second applicator relative to thefirst applicator along the X and Y axes prior to dispensing to therebyenable simultaneous dispensing of identical fluid patterns onto globallyrotated first and second substrates.

However, traditional dual dispensing methods have not includedautomatically repositioning the first and second applicators relative toeach other along the X or Y axes while actively dispensing. In otherwords, traditional dual dispensing systems do not perform active,real-time positional adjustments of the first and second applicatorsrelative to each other in the XY plane while dispensing. Consequently,traditional dual dispensing methods have not accomplished accuratesimultaneous dispensing of identical fluid patterns at first and seconddispense regions, such as first and second substrates, that are rotatedrelative to each other in the XY plane (i.e., “locally rotated”). Forexample, a first rectangular substrate may be aligned parallel with theX and Y axes and a second rectangular substrate may be rotated in the XYplane relative to the X and Y axes. Such local rotation may occur when asubstrate is sized smaller than the carrier tray pocket in which itsits, thereby forming one or more gaps between the outer perimeter ofthe substrate and the inner wall of the pocket. The substrate is thuspermitted to rotate within the pocket in the XY plane, and relative toany one or more adjacent substrates. Additionally, local rotation may bepresent among multiple dispense regions of a single substrate, forexample a panelized circuit board. Traditional dual dispensing methodsare deficient in actively correcting for such local rotation whiledispensing.

Furthermore, traditional dual dispensing methods have not includedactively repositioning the first or second applicator relative to eachother along the vertical Z axis of the dispensing system while the firstand second applicators are dispensing. Accordingly, traditional dualdispensing systems have not accomplished accurate dual dispensing atfirst and second dispense regions, such as first and second substrates,where the first and second dispense regions are tilted in the XY planerelative to each other, or where one of the dispense regions is uniquelycontoured relative to the XY plane, along the Z axis. Thus, dispenseregions that are “rotated” relative to each other may lay in a common XYreference plane. In contrast, dispense regions that are “tilted” and/or“contoured” relative to each other do not lie in a common plane, and thedispense regions are uniquely tilted and/or uniquely contoured relativeto the XY reference plane, as described in greater detail below inconnection with embodiments of the invention (see e.g., FIG. 13A).

In illustration of the discussion above, FIG. 1 shows a carrier tray 10having a plurality of adjacent pockets 12 a, 12 b, 12 c, and 12 d forreceiving a corresponding plurality of substrates 14 a, 14 b, 14 c, and14 d. As shown, each substrate 14 a-14 d may include a correspondingcomponent 16 a, 16 b, 16 c, and 16 d mounted thereto. Each pocket 12a-12 d has a depth in a direction perpendicular to the XY plane, and issized and shaped to retain the corresponding substrate 14 a-14 d in acentered position and in proper orientation relative to a global originO. FIG. 2 shows a carrier tray 20 in which pockets 22 a, 22 b, 22 c, and22 d are sized slightly larger than their corresponding substrates 24 a,24 b, 24 c, and 24 d held therein, such that gaps are created betweenthe outer perimeter of each substrate A-D and the inner walls of itscorresponding pocket 22 a-22 d. Accordingly, each substrate 24 a-24 d ispermitted to shift and thereby become rotated and/or translated in theXY plane relative to its centered orientation (shown in phantom) andrelative to each of the other substrates 24 a-24 d.

FIG. 3 shows the carrier tray 20 and substrates 24 a-24 d of FIG. 2, butwhere substrate 24 b is tilted relative to the XY plane. Morespecifically, FIG. 3A shows an angular offset between a bottom surface26 of substrate 24 b and a base surface 28 of its pocket 22 b, therebyforming a wedge-shaped gap 25. Such tilting may be caused by thepresence of a foreign material between the bottom surface 26 and thebase surface 28. Alternatively, tilting of a substrate may occur if thesubstrate is malformed, for example through warping. As discussed above,traditional dual dispensing methods have not accomplished automated,real-time adjustment of applicator positioning while dispensing so as toaccurately dispense at first and second dispense regions, such as firstand second substrates, that are misaligned in the manners shown in FIGS.2-3A. Accordingly, there is a need for dual dispensing methods andsystems that address such deficiencies.

SUMMARY

An exemplary method is provided for dispensing a first fluid pattern ata first dispense region and a second fluid pattern at a second dispenseregion. The first and second dispense regions may be first and secondindependent substrates, as primarily shown and described herein, or theymay be separate regions of a common substrate, for example. The firstand second dispense regions are positioned relative to a reference planedefined by a first axis and a second axis orthogonal to the first axis.Positions of the first and second dispense regions in the referenceplane are determined. Positions of the first dispense region and thesecond dispense region along a third axis are determined, the third axisbeing mutually orthogonal with the first and second axes. A firstapplicator is moved toward the first dispense region with a positionerand the second applicator is moved toward the second dispense regionwith the positioner. The first fluid pattern is dispensed at the firstdispense region with the first applicator and the second fluid patternis simultaneously dispensed at the second dispense region with thesecond applicator. The second applicator is moved relative to the firstapplicator in at least one of a direction parallel to the first axis, adirection parallel to the second axis, or a direction parallel to thethird axis while the first applicator dispenses at the first dispenseregion and the second applicator simultaneously dispenses at the seconddispense region.

Another exemplary method is provided for dispensing a first fluidpattern at a first dispense region and a second fluid pattern at asecond dispense region. The first and second dispense regions arepositioned relative to a reference plane defined by a first axis and asecond axis orthogonal to the first axis. The first dispense region isprovided with at least one of a first tilt or a first contour relativeto the reference plane and along a third axis mutually orthogonal withthe first axis and the second axis. The at least one of the first tiltor the first contour is unique to the first dispense region. The methodincludes determining a first dispense height path corresponding to theat least one of the first tilt or the first contour of the firstdispense region. The first dispense height path is unique to the firstdispense region. The method further includes moving the first applicatoralong the first dispense height path to dispense the first fluid patternat the first dispense region. Simultaneously, the second applicator ismoved relative to the second dispense region to dispense the secondfluid pattern at the second dispense region.

Another exemplary method is provided for positioning a first applicatorfor dispensing fluid at a first dispense region and positioning a secondapplicator for dispensing fluid at a second dispense region. The firstdispense region and the second dispense region are positioned relativeto a reference plane defined by a first axis and a second axisorthogonal to the first axis. Positions of the first and second dispenseregions in the reference plane are determined. Positions of the firstdispense region and the second dispense region along a third axis aredetermined, the third axis being mutually orthogonal with the first andsecond axes. A primary positioner is controlled to move the firstapplicator and the second applicator in at least one of a directionparallel to the first axis or a direction parallel to the second axis toposition the first applicator relative to the first dispense region.Simultaneously, a secondary positioner coupled to the primary positioneris controlled to move the second applicator relative to the firstapplicator in at least one of a direction parallel to the first axis ora direction parallel to the second axis to position the secondapplicator relative to the second dispense region.

An exemplary dispensing system is provided for dispensing fluid at afirst dispense region and a second dispense region. The first and seconddispense regions are each positioned relative to a reference planedefined by a first axis and a second axis orthogonal to the first axis.The system includes a first applicator for dispensing fluid at the firstdispense region, and a second applicator for dispensing fluid at thesecond dispense region. A primary positioner is configured to positionthe first applicator for dispensing fluid at the first dispense region.The primary positioner supports the first applicator and has a firstdrive to move the first applicator in a direction parallel to the firstaxis, a second drive to move the first applicator in a directionparallel to the second axis, and a third drive to move the firstapplicator in a direction parallel to a third axis. The third axis ismutually orthogonal with the first and second axes. A secondarypositioner is coupled to the primary positioner and is configured toposition the second applicator for dispensing fluid at the seconddispense region. The secondary positioner supports the second applicatorand has a first drive to move the second applicator relative to thefirst applicator in a direction parallel to the first axis, a seconddrive to move the second applicator relative to the first applicator ina direction parallel to the second axis, and a third drive to move thesecond applicator relative to the first applicator in a directionparallel to the third axis. The first drives, the second drives, and thethird drives associated with the primary positioner and the secondarypositioner are controlled by a system controller.

Various additional features and advantages of the invention will becomemore apparent to those of ordinary skill in the art upon review of thefollowing detailed description of the illustrative embodiments taken inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate embodiments of the invention and,together with a general description of the invention given above, andthe detailed description of the embodiments given below, serve toexplain the principles of the invention.

FIG. 1 is a top elevational view showing a carrier tray containing aplurality of substrates each aligned in proper, centered orientations.

FIG. 2 is a top elevational view showing a carrier tray containing aplurality of substrates each rotated or translated from their centeredorientations.

FIG. 3 is a top elevational view similar to FIG. 2, showing a substratetilted relative to a horizontal XY plane.

FIG. 3A is a side cross-sectional view taken along line 3A-3A of FIG. 3,showing the substrate tilted relative to the horizontal XY plane.

FIG. 4 is an isometric schematic view of a dual applicator dispensingsystem according to an embodiment of the invention.

FIG. 5 is an isometric schematic view similar to FIG. 3, showing asecondary positioner disassembled from a primary positioner.

FIG. 6 is a top elevational view of the dispensing system of FIG. 4,further showing a parts carrier tray in which the substrates are eachrotated or translated from their centered orientations.

FIG. 7 is a top elevational view of first and second substrates of FIG.6, showing positions of first and second applicator dispense tips priorto dispensing first and second fluid patterns.

FIG. 8 is a top elevational view similar to FIG. 7, showing positions ofthe applicator dispense tips after dispensing first portions of thefluid patterns.

FIG. 9 is a top elevational view similar to FIG. 7, showing positions ofthe applicator dispense tips after dispensing second portions of thefluid patterns.

FIG. 10 is a top elevational view similar to FIG. 7, showing positionsof the applicator dispense tips after dispensing third portions of thefluid patterns.

FIG. 11 is a top elevational view similar to FIG. 7, showing positionsof the applicator dispense tips after dispensing fourth portions of thefluid patterns.

FIG. 12A is an isometric view showing a substrate that is tiltedrelative to an XY plane, and a corresponding dispense height path alongwhich an applicator moves while dispensing onto the tilted substrate.

FIG. 12B is an isometric view showing a substrate that is contouredrelative to the XY plane, and a corresponding dispense height path alongwhich an applicator moves while dispensing onto the contoured substrate.

FIG. 13A is side elevational view showing first and second dispenseregions provided on first and second substrates that are each uniquelytilted and contoured relative to the XY plane, and a unique dispenseheight path corresponding to each dispense region.

FIG. 13B is a side elevational view showing first and second dispenseregions provided on a single contoured substrate, and a unique dispenseheight path corresponding to each dispense region.

FIGS. 14A and 14B present a flow diagram illustrating steps of a methodfor simultaneously dispensing at first and second dispense regions.

DETAILED DESCRIPTION

Turning to FIGS. 4 and 5, an exemplary dual applicator fluid dispensingsystem 30 for dispensing viscous fluids at a plurality of dispenseregions, such as independent substrates A, B, C, D held in a carriertray 32, is shown schematically. While only four substrates A-D areshown herein, arranged in a rectangular configuration in correspondingpockets 33 a, 33 b, 33 c, 33 d, the carrier tray 32 may be adapted tocarry any desired number of substrates arranged in any desiredconfiguration. Alternatively, the multiple dispense regions may bedistinct regions of a single substrate, as discussed above. In thisregard, while dispense regions are primarily exemplified herein asmultiple independent substrates, it will be appreciated that,alternatively, dispense regions may be part of single common substrate,for example as shown in FIG. 13B. In one embodiment, the dispenseregions may be part of a panelized substrate, such as a panelizedcircuit board (not shown).

The carrier tray 32 may be positioned on a conveyor belt (not shown),which may be operated to deliver the carrier tray 32 to a positiongenerally beneath the dispensing system 30 such that the substrates A-Dcarried therein may be dispensed upon by the dispensing system 30.Alternatively, the carrier tray 32 may be positioned on any othersuitable platform, such as a stationary table or pedestal, locatedgenerally within an operating perimeter of the dispensing system 30. Thedual dispensing system 30 includes a first fluid applicator 34 mountedto a primary positioner 36 and a second fluid applicator 38 mounted to asecondary positioner 40. The secondary positioner 40 is coupled to andmovable by the primary positioner 36. The positioners 36, 40collectively define a gantry 42 for positioning the first applicator 34for dispensing at a first dispense region and the second applicator 38for simultaneously dispensing at a second dispense region, as describedin greater detail below.

The dual dispensing system 30 defines a global origin O and threemutually orthogonal global axes X, Y, and Z. The primary positioner 36is movable in directions parallel to the global X, Y, and Z axes,denoted generally by x₁, y₁, and z₁, respectively, and correspondingdirectional arrows. Similarly, the secondary positioner 40 is alsomovable in directions parallel to the global X, Y, and Z axes, denotedgenerally by x₂, y₂, and z₂, respectively, and corresponding directionalarrows.

The primary positioner 36 includes a pair of opposed x₁ supports 44 aand 44 b aligned parallel with the X axis and shown generally aslongitudinal beams. The x₁ supports 44 a, 44 b are each provided with anx₁ bearing 46 a and 46 b, respectively, shown as linear bearings, forenabling x₁ linear movement of the applicators 34, 38 parallel to the Xaxis. The primary positioner 36 further includes a transversely orientedy₁ support 48 aligned parallel with the Y axis and shown generally as alateral beam. The y₁ support 48 is provided with a pair of y₁ bearings50 a and 50 b, shown as linear bearings, for enabling y₁ linear movementof the applicators 34, 38 parallel to the Y axis. The y₁ support 48 ismovably coupled to the x₁ supports 44 a, 44 b through a pair of opposedlegs 52 a and 52 b, which engage and are slidable along the x₁ bearings46 a, 46 b, respectively, for x₁ movement. The primary positioner 36further includes a y₁ carriage 54 having a lower XY surface that engagesand is slidable along the y₁ bearings 50 a, 50 b for y₁ movement. The y₁carriage 54 has a YZ surface (i.e., a surface lying in the YZ plane) towhich is attached a vertically oriented z₁ support 56, aligned parallelwith the Z axis and shown generally in the form of a plate. The z₁support 56 includes a pair of vertically oriented z₁ bearings 58 a and58 b, shown as linear bearings, for enabling z₁ linear movement of theapplicators 34, 38 in a direction parallel to the Z axis. As shown, thez₁ bearings 58 a, 58 b may be provided on adjacent XZ and YZ surfaces,respectively, of the z₁ support 56. A z₁ carriage 60, shown in the formof an L-shaped bracket, has a first leg 62 a and a second leg 62 b thatengage and are slidable along the z₁ bearings 58 a, 58 b, respectively,for z₁ movement. A first applicator mounting mechanism 64 may be coupledto the second leg 62 b and may be configured to releasably support thefirst applicator 34, as described in greater detail below.

The secondary positioner 40 is coupled to the primary positioner 36 andenables x₂, y₂, and z₂ movements of the second applicator 38 relative tothe primary positioner 36 and the first applicator 34 mounted thereon.The secondary positioner 40 includes a y₂ support 70 which may act as abase plate and may be rigidly coupled at a YZ surface to the first leg62 a of the z₁ carriage 60 of the primary positioner 36. The y₂ support70 may include a pair of y₂ bearings 72 a and 72 b, shown as linearbearings, which may be positioned adjacent to each other on an opposedYZ surface of the y₂ support 70. The y₂ bearings 72 a, 72 b are alignedparallel with the Y axis to enable y₂ movement of the second applicator38 relative to the primary positioner 36. The secondary positioner 40further includes a z₂ support 74, shown generally as a plate. A YZsurface of the z₂ support 74 may engage and be slidable along the y₂bearings 72 a, 72 b for y₂ movement. An opposed YZ surface of the z₂support 74 may include a pair of z₂ bearings 76 a and 76 b, shown aslinear bearings, which are aligned parallel with the Z axis to enable z₂movement of the second applicator 38 relative to the primary positioner36.

A z₂ carriage 78, shown generally in the form of a plate, may include aYZ surface that engages and is slidable along the z₂ bearings 76 a, 76 bfor z₂ movement. An x₂ support 80 may be rigidly coupled to an XZsurface of the z₂ carriage 78, in a perpendicular orientation.Alternatively, the x₂ support 80 and the z₂ carriage 78 may be formedintegrally. The x₂ support 80 may include an x₂ bearing 82, shown as alinear bearing, that is aligned parallel with the X axis to enable x₂movement of the second applicator 38 relative to the primary positioner36. A second applicator mounting mechanism 84 may engage and be slidablealong the x₂ bearing 82 for x₂ movement, and may be configured toreleasably support the second applicator 38, as described in greaterdetail below.

The first and second applicator mounting mechanisms 64, 84 may beconfigured to receive and releasably engage the first and secondapplicators 34, 38, respectively. For example, the applicator mountingmechanisms 64, 84 may each include a quick-disconnect feature (notshown) that enables proper alignment with the corresponding applicator34, 38 through one or more projections and mating recesses. U.S. Pat.No. 6,214,117 and EP Patent No. 1 165 250 B1, the disclosures of whichare hereby incorporated by reference herein, show prior art examples ofquick disconnect mechanisms for mounting applicators to mechanisms formoving the applicators.

The first and second applicators 34, 38 may be of any preferred typesuitable for a user's intended application, such as an air-operatedneedle valve or jet of the types made available by Nordson ASYMTEK ofCarlsbad, Calif., for example. As shown best in FIGS. 4 and 5, eachapplicator 34, 38 may be in the form of a pneumatically operated jettingvalve such as a model DJ 9000 valve available from Nordson ASYMTEK. Asshown, each applicator 34, 38 may include a corresponding fluidreservoir 86, 88 for storing viscous fluid, an actuator 90, 92, forjetting, or dispensing, viscous fluid from a dispensing tip 94, 96 forapplication to a substrate A-D positioned beneath the dispensing tip 94,96. An example of a suitable dispenser is shown in U.S. Pat. No.8,578,729, the disclosure of which is hereby incorporated by referenceherein. As discussed above, the viscous fluid may be any solder paste,underfill material, adhesive, or encapsulant, for example.

Movement of the primary and secondary positioners 36, 40 may bepreferably accomplished through a series of controllable, powered drivemechanisms. More specifically, each direction of movement x₁, y₁, z₁,x₂, y₂, and z₂ may be powered by at least one corresponding powereddrive mechanism. As shown, a pair of x₁ drive mechanisms 100 a and 100 bmay operate in parallel to power x₁ movement along the x₁ bearings 46 a,46 b, respectively, and may be provided internally within or adjacent tothe legs 52 a, 52 b, respectively. Alternatively, x₁ movement may bepowered by a single drive mechanism (not shown). A y₁ drive mechanism102 may power y₁ movement along the y₁ bearings 50 a, 50 b and may beprovided internally within or adjacent to the y₁ carriage 54, as shown.A z₁ drive mechanism 104 may power z₁ movement along the z₁ bearings 58a, 58 b and may be provided adjacent to an external XZ surface of the z₁support 56, as shown. A y₂ drive mechanism 106 may power y₂ movementalong the y₂ bearings 72 a, 72 b and may be provided adjacent to anexternal XZ surface of the y₂ support 70, as shown. A z₂ drive mechanism107 may power z₂ movement along the z₂ bearings 76 a, 76 b and may beprovided adjacent to an external upper XY surface of the z₂ carriage 78,as shown. An x₂ drive mechanism 108 may power x₂ movement along the x₂bearing 82 and may be provided adjacent to an external YZ surface of thesecond applicator mounting mechanism 84, as shown.

In one embodiment, the drive mechanisms 100 a, 100 b, 102, 104, 106,107, 108 may include stepper motors. Alternatively, the drive mechanisms100 a, 100 b, 102, 104, 106, 107, 108 may include any other suitableelectric, pneumatic, or hydraulic drive adapted to movement with a highdegree of accuracy, repeatability, and stability. Additionally, thedrive mechanisms 100 a, 100 b, 102, 104, 106, 107, 108 may include anyadditional mechanical drive elements suitable for moving the positioners36, 40. For example, in one embodiment (not shown) the drive mechanisms100 a, 100 b, 102, 104, 106, 107, 108 may include stepper motors eachhaving an output shaft connected with a flexible drive coupling to alead screw. The lead screw may rotate with the motor and engages athreaded or toothed element mounted on a corresponding support toactuate movement along a corresponding linear bearing. The drivemechanisms 100 a, 100 b, 102, 104, 106, 107, 108 may be mounted at anysuitable locations within the dispensing system 30 different from thoseshown and described herein.

As presented above, the secondary positioner 40 is coupled to theprimary positioner 36 and thus the x₁, y₁, and z₁ movements of theprimary positioner 36 are transferrable to the secondary positioner 40and the second applicator 38 mounted thereon. The secondary positioner40 enables additional movements x₂, y₂, and z₂ relative to the primarypositioner 36, which movements may be relatively fine in comparison tothe corresponding x₁, y₁, and z₁ movements performed by the primarypositioner 36. Accordingly, in one embodiment, the secondary positioner40 is movable with ranges of motion that are less than correspondingranges of motion of the primary positioner 36. More specifically, theprimary positioner may have a range of motion in each of the directionsparallel to the X axis, the Y axis, and the Z axis (i.e., x₁, y₁, and z₁movements). Similarly, the secondary positioner 40 may have a range ofmotion in each of the directions parallel to the X axis, the Y axis, andthe Z axis (i.e., x₂, y₂, and z₂ movements). The ranges of motion of thesecondary positioner 40 may be smaller than the corresponding ranges ofmotion of the primary positioner 36. In this manner, the primarypositioner 36 may perform a primary movement to move the firstapplicator 34 and the second applicator 38, the primary movement definedby any one or combination of x₁, y₁, and z₁ movements and having amagnitude. Simultaneously, the secondary positioner 40 may perform asecondary movement relative to the primary positioner 36 to move thesecond applicator 38 relative to the first applicator 34, the secondarymovement defined by any one or combination of x₂, y₂, and z₂ movementsand having a magnitude that is less than the magnitude of the primarymovement.

Accordingly, the first applicator 34 may be positioned with the primarypositioner 36, and the second applicator 38 may be jointly positioned bythe primary positioner 36 and the secondary positioner 40. Morespecifically, the first applicator 34 and the second applicator 38 areboth positionable with y₁, and z₁ movements. The second applicator 38 isadditionally positionable with x₂, y₂, and z₂ movements made relative tothe primary positioner 36. Thus, the structural configuration of thedispensing system 30 enables the second applicator 38 to be movedrelative to the first applicator 34 in directions parallel to the X, Y,and Z axes. Thereby, the first and second applicators 34, 38 maysimultaneously dispense first and second fluid patterns onto first andsecond substrates, respectively, where the fluid patterns aresubstantially identical in size and shape and where the substrates aremisaligned relative to each other. As described above, the fluidpatterns may include one or more lines, arcs, dots, combinationsthereof, and/or any other configuration of continuously orintermittently dispensed fluid.

The primary positioner 36 and the secondary positioner 40 areindependently controllable with at least one controller (not shown),such as a computer. Preferably, the controller is configured to instructthe x₁, y₁, and z₁ movements of the primary positioner 36, and tosimultaneously instruct the x₂, y₂, and z₂ movements of the secondarypositioner 40 by controlling the drive mechanisms 100 a, 100 b, 102,104, 106, 107, 108. In this manner, the primary positioner 36 iscontrollable such that the first applicator 34 may be properlypositioned relative to and dispense at a first dispense region, such assubstrate A. Simultaneously, the secondary positioner 40 isindependently controllable such that the second applicator 38 may beproperly positioned relative to and dispense at a second dispenseregion, such as substrate B. As discussed in greater detail below, thepositioners 36, 40 are controllable to account for misalignment betweena first dispense region and a second dispense region, such as substratesA and B, for example.

Having just described a dispensing system that is novel in structure,methods of simultaneously dispensing at first and second dispenseregions will now be described. The methods are described herein withreference to substrates A, B, C, D shown in FIGS. 6-11. As discussedabove, persons skilled in the art will appreciate that the dispensingmethods described herein may be adapted for simultaneously dispensing atany two dispense regions of a plurality of dispense regions with thedispensing system 30. For example, first and second dispense regions maybe part of a single substrate, such as a panelized substrate.

The dispensing system 30 may first identify the location and orientationof each substrate A, B, C, D in the XY plane relative to a global originO, based on the positions of at least two reference fiducials 110 a, 110b provided on each substrate A-D. For example, with reference tosubstrate A, the two fiducials 110 a, 110 b may be provided at opposingcorners of an upper XY surface of the substrate A. While shown herein asan “x” enclosed by a circle, the fiducials 110 a, 110 b may be anyidentifiable mark such as a letter, number, dot, or pattern, forexample. In this manner, the dispensing system 30 may determine whethereach substrate is rotated and/or translated in the XY plane relative toa corresponding reference position defined with respect to origin O.

The dual dispensing system 30 includes a camera 112 for identifying thereference fiducials 110 a, 110 b. The camera 112 may be mounted to thegantry 42 at any suitable location, such as a portion of the secondarypositioner 40, as shown in FIG. 6. For fiducial identification, thegantry 42 may be controlled to move the camera 112 along apre-programmed path based on expected locations of the fiducials 110 a,110 b in the XY plane. In one mode, the gantry 42 may be controlled tosequentially pause at the expected location of each fiducial 110 a, 110b so that the camera 112 may capture a visual image of a fiducial 110 a,110 b during each pause. In another mode, the gantry 42 may becontrolled to continuously move and the camera 112 may capture visualimages of the fiducials 110 a, 110 b during movement. Based on theimages of the fiducials 110 a, 110 b captured by the camera 112, thecontroller may then determine the actual position of each substrate A,B, C, D in the XY plane.

The dual dispensing system 30 further includes a height sensor 114 forperforming height sensing operations, which includes measuring theposition of each substrate A-D along the Z axis, relative to the XYplane. The height sensor 114 may be a non-contact laser sensor, oralternatively may be a contact mechanical sensor. In operation, thegantry 42 may be controlled to move the height sensor 114 along apre-programmed path for measuring the position each substrate A-D alongthe Z axis. These measurements, referred to herein as Z heightmeasurements, enable the controller to determine for each substrate A-Da proper height along the Z axis, referred to as a dispense height, towhich the dispensing tip 94, 96 of the first or second applicator 34, 38should be lowered for dispensing fluid onto the substrate A-D. In thismanner, the system 30 may ensure a proper dispense gap between thedispensing tips 94, 96 and the corresponding substrates A-D whiledispensing.

As shown in FIG. 6, the substrates A-D may lie generally parallel to theXY plane, and thus a single height measurement for each substrate A-Dmay be sufficient. Alternatively, one or more of the substrates A-D maybe tilted relative to the XY plane (see, e.g., FIGS. 3A, 12A) such thatthe substrate is positioned at various points along the Z axis. In suchcase, the height sensor 114 may be operated to measure multiple heightsof the tilted substrate and thereby map the tilt along the Z axis.Similarly, multiple Z height measurements may also be collected for asubstrate having a surface, onto which fluid is to be dispensed, that iscontoured relative to the XY plane and along the Z axis (referred toherein as a “contoured substrate,” and similar variations thereof), asshown in FIGS. 12B-13B. As described in greater detail below, themultiple Z height measurements collected for a tilted and/or contouredsubstrate may then be used by the controller to determine z₁ or z₂movements that the primary positioner 36 or the secondary positioner 40must actively perform during dispensing in order to accommodate thetilted orientation of the substrate or its contoured surface. The camera112 and height sensor 114 may be integrated into a single systemoperable by the controller for collecting fiducial information andheight measurements for each of the substrates A-D to be dispensed upon.

Based on the information gathered by the controller during the fiduciallocating and height sensing operations described above, the primary andsecondary positioners 36, 40 may be operated to simultaneously positionthe first applicator 34 relative to a first substrate and the secondapplicator 38 relative to a second substrate. The first applicator 34may then dispense a first fluid pattern onto the first substrate whilethe second applicator 38 simultaneously dispenses a second, identicalfluid pattern onto the second substrate. The positioners 36, 40 areautomatically movable while dispensing to actively correct for anypositional misalignment of one of the substrates relative to the other.These positioning and dispensing steps may be performed with respect toany two of the substrates A-D, for example, which are each rotatedand/or translated along the X and Y axes relative to each of the othersubstrates A-D, as shown in FIGS. 6-11.

FIGS. 7-11 show a series of steps in which the first applicator 34 ispositioned relative to substrate A and dispenses a fluid pattern 116thereon. Simultaneously, the second applicator 38 is positioned relativeto substrate B and dispenses a substantially identical fluid pattern 118thereon. Substrates A and B are shown each misaligned from theirrespective centered positions within their respective pockets 33 a, 33 b(see, e.g., FIG. 2). The geometric centers of the pockets 33 a, 33 b inthe XY plane are represented by crosshairs. As shown, substrate A isrotated from its centered position relative to the X and Y axes, whilesubstrate B is translated from its centered position along the X and Yaxes. Accordingly, substrates A and B are rotated and translatedrelative to each other with respect to the X and Y axes. As describedbelow, the second applicator 38 is movable in the XY plane relative tothe first applicator 34 while dispensing to thereby actively andautomatically correct for misalignments of the substrates A, B in the XYplane.

As shown, the first and second applicator dispensing tips 94, 96 areeach represented in FIGS. 7-11 by a pair of concentric phantom circles.The shapes of the fluid patterns 116, 118 to be dispensed arerepresented by directional arrows forming generally rectangular outlinesabout the perimeters of components 120 a, 120 b provided on thesubstrates A, B. Accordingly, FIGS. 7-11 simulate dispensing of anadhesive underfill material which is dispensed along the edge of acomponent, such as a flip chip having a grid of solder balls on itsunderside which are positioned on corresponding matching contact pads onthe substrate, with the underfill material flowing under the chip andaround the solder balls to secure the flip chip to the substrate.Persons of ordinary skill in the art will appreciate that thepositioners 36, 40 and the applicators 34, 38 mounted thereon may becontrolled to dispense fluid patterns of any other desired shape and atany other desired region of one or more substrates or other similarworkpieces. For example, as discussed above, the fluid patterns mayinclude one or more lines, arcs, dots, combinations thereof, and/or anyother configuration of continuously or intermittently dispensed fluid.

Referring to FIG. 7, the controller may command the primary positioner36 to execute x₁ and y₁ movements to thereby position the firstapplicator dispensing tip 94 to overlie a first dispense site 122 onsubstrate A. Simultaneously, the controller may command the secondarypositioner 40 to execute x₂ and y₂ movements relative to the primarypositioner 36 to thereby position the second applicator dispensing tip96 over a corresponding first dispense site 124 on substrate B. Thecontroller may then command the primary positioner 36 to executedownward z₁ movement to thereby advance the first and second dispensingtips 94, 96 simultaneously toward their proper dispense heights, asdetermined during the height sensing operation described above. If thecontroller determines, through the height sensing operation, thatsubstrates A and B are each positioned at the same location along the Zaxis, the first and second dispensing tips 94, 96 may be positioned atthe same dispense height through z₁ movement of the primary positioner36. If the controller determines, through the height sensing operation,that substrates A and B are positioned at different locations along theZ axis, the controller may additionally command the secondary positioner40 to execute z₂ movement relative to and simultaneously with the z₁movement of the primary positioner 36. Thereby, the first and seconddispensing tips 94, 96 may be simultaneously positioned at their proper,respective dispensing heights. The dispensing system 30 may now dispenseonto substrates A and B.

As shown in FIG. 8, the first applicator 34 and its dispensing tip 94may be moved by the primary positioner 36 to dispense a first leg 116 aof fluid pattern 116. Simultaneously, the second applicator 38 and itsdispensing tip 96 may be moved by the secondary positioner 40 relativeto the primary positioner 36 and the first applicator 34 to dispense afirst leg 118 a of fluid pattern 118. More specifically, the controllermay command the primary positioner 36 to execute x₁ and y₁ movements,and further command the secondary positioner 40 to simultaneouslyexecute corrective x₂ and y₂ movements relative to the primarypositioner 36. The controller may issue such commands based on the knownlocations and orientations of the substrates A, B in the XY plane asdetermined by the controller during the fiducial identification processdescribed above. In this manner, the dispensing system 30 mayautomatically and actively adjust positioning of the first and secondapplicators 34, 38 while dispensing to correct for local rotation ofsubstrates A and B.

As shown in FIG. 9, the first applicator 34 and its dispensing tip 94may be moved by the primary positioner 36 to dispense a second leg 116 bof fluid pattern 116. Simultaneously, the second applicator 38 and itsdispensing tip 96 may be moved by the secondary positioner 40 relativeto the primary positioner 36 and the first applicator 34 to dispense asecond leg 118 b of fluid pattern 118. More specifically, the controllermay command the primary positioner 36 to execute x₁ and y₁ movements,and further command the secondary positioner 40 to simultaneouslyexecute corrective x₂ and y₂ movements relative to the primarypositioner 36 while dispensing to correct for the local rotation ofsubstrates A and B.

As shown in FIG. 10, the first applicator 34 and its dispensing tip 94may be moved by the primary positioner 36 to dispense a third leg 116 cof fluid pattern 116. Simultaneously, the second applicator 38 and itsdispensing tip 96 may be moved by the secondary positioner 40 relativeto the primary positioner 36 and the first applicator 34 to dispense athird leg 118 c of fluid pattern 118. More specifically, and assimilarly performed when dispensing the first legs 116 a, 118 a, thecontroller may command the primary positioner 36 to execute x₁ and y₁movements, and simultaneously the controller may command the secondarypositioner 40 to execute corrective x₂ and y₂ movements relative to theprimary positioner 36 to correct for the local rotation of substrates Aand B.

As shown in FIG. 11, the first applicator 34 and its dispensing tip 94may be moved by the primary positioner 36 to dispense a fourth leg 116 dof fluid pattern 116. Simultaneously, the second applicator 38 and itsdispensing tip 96 may be moved by the secondary positioner 40 relativeto the primary positioner 36 and the first applicator 34 to dispense afourth leg 118 d of fluid pattern 118, thereby completing the fluidpatterns 116, 118. More specifically, and as similarly performed whendispensing the second legs 116 b, 118 b, the controller may command theprimary positioner 36 to execute x₁ and y₁ movements, and simultaneouslythe controller may command the secondary positioner 40 to executecorrective x₂ and y₂ movements relative to the primary positioner 36 tocorrect for the local rotation of substrates A and B.

One or both of the substrates A, B may be tilted relative to the XYplane, as demonstrated by substrate 130 in FIG. 12A. As described above,the height sensor 114 may be operated to collect multiple heightmeasurements of a tilted substrate along the Z axis, and thesemeasurements may then be conveyed to the controller. As shown in FIG.12A, the controller may then determine a dispense height path P thatvaries in height along the Z axis and along which a correspondingdispensing tip 94, 96 may be moved in order to maintain a constant andaccurate dispense gap G between the tip 94, 96 and the tilted substrate130. Thus, if the substrate B of FIGS. 7-11, and its correspondingcomponent 120 b, had a tilt like that shown for substrate 130, inaddition to making the x₂ and y₂ corrections as described above, thesecondary positioner 40 would make corrective z₂ movements relative tothe primary positioner 36, while dispensing, to correct for the tilt ofsubstrate B with respect to substrate A. In this manner, the system 30may accurately dispense a fluid pattern, such as pattern 118, onto thetilted substrate. Consequently, as shown in FIG. 12A, corrective z₂movements would be made along the Z axis such that the dispensing tip 96travels in a plane substantially parallel to the tilted substrate.

A similar process may be performed where one or both of the substratesA, B is contoured relative to the XY plane, along the Z axis, asdemonstrated by substrate 132 in FIG. 12B, which could be a warpedsubstrate, for example. In particular, the system may collect multiple Zheight measurements corresponding to a contoured substrate. As shown inFIG. 12B, the system 30 may then determine a corresponding dispenseheight path P that varies in height along the Z axis and along which acorresponding dispensing tip 94, 96 may be moved in order to maintain aconstant and accurate dispense gap G between the tip 94, 96 and thecontoured substrate 132. The process described above with respect to thetilted substrate shown in FIG. 12A may also be applied to contouredsubstrates. For example, if the substrate B shown in FIGS. 7-11 had acontour like that shown for substrate 132, in addition to making the x₂and y₂ corrections as described above, the secondary positioner 40 wouldalso make corrective z₂ movements relative to the primary positioner 36,while dispensing, to correct for the contour of substrate B with respectto substrate A. In this manner, the system 30 may accurately dispense afluid pattern, such as fluid pattern 118, onto the contoured substrate.Consequently, as shown in FIG. 12B, corrective z₂ movements would bemade along the Z axis such that the dispensing tip 96 travels along apath that substantially conforms to the contoured substrate.

As demonstrated by substrates 134 and 136 in FIG. 13A, two substratesbeing dispensed upon, for example substrates A and B, may each beuniquely tilted and contoured relative to the XY plane and relative toeach other, and corresponding dispense height paths P1 and P2 may bedetermined by the system 30 based on the detected Z height measurements.In another embodiment, instead of using a height sensor, electronic datadefining the tilt and/or contour of a substrate may be entered into thesystem 30 by a user. Such electronic data may then be used to determinea dispense height path.

In another embodiment (not shown), first and second substrates may bearranged such that they are not rotated relative to each other in the XYplane, and each substrate is provided with the same tilt and/or contourrelative to the XY plane such that the substrates are not uniquelytilted or contoured relative to each other. In such case, the dispenseheight paths determined by the system 30 for the substrates may besubstantially identical, and the secondary positioner 40 need not makecorrective movements relative to the primary positioner 36 duringdispense. In other words, the first and second applicators may remainstationary relative to each other while moving together along X, Y, andZ to simultaneously dispense on the first and second substrates.

With reference to substrates A and B of FIGS. 6-11, a first scenario,also described above, may arise in which substrate A is generally planarand lies parallel to the XY plane, and substrate B is tilted relative tothe XY plane and/or includes a contoured surface, as demonstrated bysubstrates 130 and 132 of FIGS. 12A and 12B. In such case, thecontroller may determine a dispense height path for tilted and/orcontoured substrate B based on height measurements collected during theheight sensing operation discussed above. Then, while the firstapplicator 34 is moved in the XY plane to dispense onto substrate A andthe second applicator 38 is simultaneously moved in the XY plane todispense onto substrate B, the controller may command the secondarypositioner 40 to simultaneously execute z₂ movements relative to theprimary positioner 36. Thereby, the second dispensing tip 96 is movablealong the pre-determined dispense height path while the secondapplicator 38 dispenses onto tilted and/or contoured substrate B. Inthis manner, the dispensing system 30 may automatically and activelyadjust the positioning of the second applicator 38 along the Z axis tocorrect for tilt and/or contour of substrate B relative to the XY plane.

In a second scenario, substrate A may be tilted and/or contouredrelative to the XY plane, as demonstrated by substrates 130 and 132 ofFIGS. 12A and 12B, while substrate B is generally planar and liesparallel to the XY plane. In such case, the controller may determine adispense height path for tilted and/or contoured substrate A in a manneras described above. Then, while the first applicator 34 is moved in theXY plane to dispense onto tilted and/or contoured substrate A, thecontroller may command the primary positioner 36 to simultaneouslyexecute z₁ movements. Thereby, the first dispensing tip 94 is movablealong the pre-determined dispense height path while the first applicator34 dispenses onto tilted and/or contoured substrate A. Simultaneously,the second applicator 38 is moved in the XY plane to dispense ontosubstrate B, and the controller may command the secondary positioner 40to execute z₂ movements relative to the primary positioner 36, the z₂movements being substantially opposite of the z₁ movements made by theprimary positioner 36. Thereby, the second dispensing tip 96 may bemaintained at a constant, pre-determined dispense height correspondingto substrate B while the second applicator 38 dispenses onto part B.

In a third scenario, both substrates A and B may be tilted and/orcontoured relative to the XY plane. By way of example with reference toFIG. 13A, substrate A may correspond to substrate 134 and substrate Bmay correspond to substrate 136. In this regard, substrate A may beprovided with a first tilt and/or a first contour that is unique tosubstrate A, and substrate B may be provided with a second tilt and/or asecond contour that is unique to substrate B. The controller maydetermine a first dispense height path P1 corresponding to tilted and/orcontoured substrate A and a second dispense height path P2 correspondingto tilted and/or contoured substrate B, in a manner as described above.Then, while the first applicator 34 is moved in the XY plane to dispenseonto substrate A, the controller may command the primary positioner 36to simultaneously execute z₁ movements. Thereby, the first dispensingtip 94 is movable along the first dispense height path P1 to maintain afirst dispense gap G1, while the first applicator 34 dispenses ontosubstrate A. Simultaneously, while the second applicator 38 is moved inthe XY plane to dispense onto tilted and/or contoured substrate B, thecontroller may command the secondary positioner 40 to execute z₂movements relative to the primary positioner 36 to correct both for thez₁ movements executed by the primary positioner 36 and the unique tiltand/or contour of substrate B. Thereby, the second dispensing tip 96 ismovable along the second dispense height path P2 to maintain a seconddispense gap G2, while the second applicator 38 dispenses onto substrateB. In this manner, the first applicator 34 may accurately dispense ontoa uniquely tilted and/or contoured first substrate and simultaneouslythe second applicator 38 may accurately dispense onto a uniquely tiltedand/or contoured second substrate.

In an alternative embodiment similar to the third scenario describedabove, the first and second applicators 34, 38 may simultaneouslydispense first and second fluid patterns at first and second dispenseregions, respectively, that are each distinct regions of a single commonsubstrate. For example, as shown in FIG. 13B, the primary positioner 36may execute z₁ movements to move the first applicator 34 along a firstdispense height path P1 at a first uniquely contoured dispense region ofsubstrate 138. Thereby, a first dispense gap G1 associated with thefirst dispense region may be maintained while dispensing.Simultaneously, the secondary positioner 40 may execute z₂ movements tomove the second applicator 38 along a second dispense height path P2 ata second uniquely contoured dispense region of the substrate 138.Thereby, a second dispense gap G2 associated with the second dispenseregion may be maintained while dispensing. In various embodiments, thefirst and second dispense gaps G1, G2 may be the same or they may bedifferent.

In a fourth scenario, substrates A and B may both be generally planarand lie parallel to the XY plane but positioned at different distancesalong the Z axis relative to the XY plane. For example, substrate A maylie in the XY plane, while substrate B is spaced above the XY plane. Insuch case, neither substrate A nor B is tilted or contoured relative tothe XY plane, and thus active correction along the Z axis duringdispense is not required by either applicator 34, 38. The controller maydetermine an appropriate dispense height for each substrate A, B in themanner described above. Prior to dispensing, the controller may commandthe primary positioner 36 to execute z₁ movement to lower the firstdispensing tip 94 to its corresponding dispense height along the Z axisabove substrate A. Simultaneously, the controller may command thesecondary positioner 40 to execute z₂ movement relative to the primarypositioner 36 to lower the second dispensing tip 96 to its correspondingdispense height along the Z axis above substrate B. The controller maythen command the primary positioner 36 to move the first and secondapplicators 34, 38 together in the XY plane so that they maysimultaneously dispense first and second fluid patterns onto substratesA and B, respectively, while maintaining the corresponding dispenseheights for the applicators 34, 38.

In view of the disclosure above, persons of ordinary skill in the artwill appreciate that the dispensing system 30 is capable of executingx₁, y₁, and z₁ movements with the primary positioner 36 andsimultaneously executing x₂, y₂, and z₂ movements with the secondarypositioner 40. Moreover, these movements are executable while the firstapplicator 34 dispenses at a first dispense region, such as a firstsubstrate, and the second applicator 38 simultaneously dispenses at asecond dispense region, such as a second substrate. In this manner, thedispensing system 30 is controllable to automatically and activelyadjust positioning of the first and second applicators 34, 38 whiledispensing to correct for misalignment of first and second substratesbeing dispensed upon.

FIGS. 14A and 14B present a flow diagram illustrating steps of a method200 according to one embodiment of the invention for simultaneouslydispensing at first and second dispense regions in a manner consistentwith the disclosure above. The method 200 may be performed withdispensing system 30 or any suitable variation thereof, for example. Thereferenced dispense regions are denoted “DR.” As described above, thefirst and second dispense regions may be first and second substrates, orthey may be distinct first and second regions of a single substrate,such as a panelized circuit board. The referenced first and secondapplicators are denoted “A1” and “A2,” and may be mounted to and movableby primary and secondary positioners, respectively, such as positioners36 and 40 of dispensing system 30 disclosed above.

At step 202, the dispensing system first identifies reference fiducialsassociated with each of the plurality of dispense regions, for examplein the manner described above. In one embodiment, each dispense regionmay be provided with its own set of corresponding reference fiducials.In another embodiment, multiple dispense regions may be associated witha single set of reference fiducials, for example where the dispenseregions are regions of a single substrate. At step 204, the system thendetermines the location and orientation (i.e., the position) of eachdispense location in the XY plane defined by the system, based on theidentified reference fiducials. At step 206, the system then collects Zheight measurements for the dispense regions through height sensing. Asdescribed above, such height sensing may include collecting multipleheight measurements for dispense regions that are tilted and/orcontoured relative to the XY plane. For example, such height sensing mayinclude collecting multiple height measurements of a path along whichfluid is to be dispensed, the path encompassed by a dispense region.Alternatively, as described above, the system may consult surfacecontour data entered by a user for providing the Z heights.

At step 208, the system may select first and second dispense regionsfrom the plurality of dispense regions, and assign a first applicator A1for dispensing a first fluid pattern at the first dispense region and asecond applicator A2 for dispensing a second fluid pattern at the seconddispense region. At step 210, the system then assesses, for each of theselected first and second dispense regions, whether the dispense regionis tilted and/or contoured relative to the XY plane, along the Z axis.If the dispense region is not tilted or contoured, the system mayproceed to step 212 and determine a proper dispense height for theapplicator assigned to the dispense region, based on a single Z heightpreviously measured for the dispense region, as described above.Alternatively, at step 214, where the dispense region is tilted and/orcontoured relative to the XY plane, the system may determine acorresponding dispense height path based on multiple Z heights that werepreviously measured for the dispense region or otherwise provided byexternal data entered by a user, as described above. For example, whereeach dispense region is uniquely tilted and/or contoured (see FIGS. 13Aand 13B), the system may determine a unique dispense height pathcorresponding to each dispense region. At step 216, the system may thenadjust, as appropriate, the control algorithms associated with anapplicator assigned to a tilted and/or contoured dispense region toaccount for tilt and/or contour of the surface that will be dispensedupon. For example, the control algorithms of an applicator assigned to atilted and/or contoured dispense region may be adjusted so that theapplicator selectively dispenses fluid from a proper height or heightsdependent on the dispense height path while moving in directions havingX and Y components of movement, to dispense a fluid pattern.

At steps 218 a and 218 b, the system positions the first applicator inthe XY plane above a first dispense site at the first dispense region.Simultaneously, the system may move the second applicator relative tothe first applicator in the XY plane to position the second applicatorabove a first dispense site at the second dispense region. At step 220,the system then simultaneously lowers the first and second applicatorsalong the Z axis to their respective dispense heights, as determinedabove in steps 210-214. If a dispense region is tilted and/or contoured,its applicator may be lowered to an initial dispense height positionedwithin the dispense height path. At step 222, the first and secondapplicators are controlled to start dispensing fluid at the respectivedispense regions positioned below.

Starting at step 224, the first and second applicators are moved alongthe X, Y, and/or Z axes to dispense the first and second fluid patterns,respectively, according to whether either of the first and seconddispense regions is tilted and/or contoured relative to the XY plane,and/or rotated in the XY plane relative to the other dispense region(i.e., locally rotated). At step 226, if neither dispense region istilted or contoured and there is no local rotation, the system mayproceed to step 228 and move the first and second applicators togetherin the XY plane to dispense the first and second fluid patterns. Forexample, such may be accomplished with the primary positioner 36 ofdispensing system 30 through x₁ and y₁ movements. Through step 228, thesecond applicator need not be moved relative to the first applicatorwhile dispensing, because the dispense regions are neither tilted norcontoured relative to the XY plane, nor rotated relative to each otherin the XY plane. In alternative to step 228, if the dispense regions arerotated relative to each other in the XY plane, the system proceeds tosteps 230 a and 230 b. At steps 230 a and 230 b, the system moves thefirst applicator in the XY plane, for example with primary positioner36, to dispense the first fluid pattern at the first dispense region.Simultaneously, the system moves the second applicator relative to thefirst applicator in the XY plane, for example with secondary positioner40, to dispense the second fluid pattern at the second dispense region.Thereby, the system may actively correct for local rotation whiledispensing.

In an alternative to step 226, if the first dispense region and/or thesecond dispense region is tilted and/or contoured relative to the XYplane, the system may proceed to step 232. Through step 232, the systemmoves the first and second applicators according to whether the firstand second dispense regions are rotated relative to each other in the XYplane (i.e., locally rotated). If the dispense regions are not locallyrotated, the system may proceed to steps 234 a and 234 b. At steps 234 aand 234 b, the system may move the first and second applicators togetherin the XY plane, as indicated in step 234 a, for example with primarypositioner 36, to dispense the first and second fluid patterns withoutrelative movement between the applicators in XY.

Simultaneously, as indicated in step 234 b, the system may move thefirst applicator and/or the second applicator in Z along a correspondingdispense height path (determined in step 214) to account for tilt and/orcontour of a corresponding dispense region relative to the XY plane.

In alternative to steps 234 a and 234 b, if the dispense regions arelocally rotated in addition to at least one of them being tilted and/orcontoured, the system may proceed to steps 236 a, 236 b, and 236 c. Atstep 236 a, the first applicator is moved in the XY plane, for examplewith primary positioner 36, to dispense the first fluid pattern at thefirst dispense region. Simultaneously, at step 236 b, the secondapplicator is moved relative to the first applicator in the XY plane,for example with secondary positioner 40, to dispense the second fluidpattern at the second dispense region. Simultaneously, at step 236 c,the first applicator and/or the second applicator is moved in Z along acorresponding dispense height path to account for tilt and/or contour ofa corresponding dispense region relative to the XY plane.

At step 238, upon completion of dispensing the first and second fluidpatterns, the first and second applicators may be raised back up alongthe Z axis to their pre-dispense heights, for example. At step 240, thesystem may evaluate whether there are additional fluid patterns to bedispensed, for example at third and fourth dispense regions. If thereremains additional dispensing to be performed, the system may return tostep 208, as indicated by symbol B. If all dispensing is complete, thesystem may end its dispensing operations.

Methods of dispensing have been described above in connection withspecified orientations of first and second dispense regions andcorresponding movements of first and second applicators forsimultaneously dispensing at the first and second dispense regions.However, persons skilled in the art will appreciate that the methodsdescribed may be adapted as appropriate to simultaneously dispense atany two dispense regions. For example, where the first dispense regionand/or the second dispense region is uniquely tilted and/or contouredrelative to the XY plane, the system may move the first applicator andthe second applicator independently along X, Y, and/or Z whiledispensing to simultaneously dispense a first fluid pattern at the firstdispense region and a second fluid pattern at the second dispenseregion.

While the present invention has been illustrated by the description ofspecific embodiments thereof, and while the embodiments have beendescribed in considerable detail, it is not intended to restrict or inany way limit the scope of the appended claims to such detail. Thevarious features discussed herein may be used alone or in anycombination. Additional advantages and modifications will readily appearto those skilled in the art. The invention in its broader aspects istherefore not limited to the specific details, representative apparatusand methods and illustrative examples shown and described. Accordingly,departures may be made from such details without departing from thescope or spirit of the general inventive concept.

What is claimed is:
 1. A method of dispensing fluid, the method comprising: capturing at least one image of a plurality of dispense regions provided on an XY plane of one or more first electronic substrates; selecting, from the at least one image of the one or more first electronic substrates, first and second dispense regions of the plurality of dispense regions of the one or more first electronic substrates; determining, based upon the at least one image of the one or more first electronic substrates, that the first or the second dispense region of the one or more first electronic substrates is misaligned relative to the other of the first or the second dispense region of the one or more first electronic substrates; dispensing fluid from a first applicator while moving the first applicator, using a primary positioner, above and along the XY plane of the one or more first electronic substrates to form a first fluid pattern at the first dispense region of the one or more first electronic substrates; dispensing fluid from a second applicator, simultaneously with the dispensing of the fluid from the first applicator, while moving the second applicator, using the primary positioner and a secondary positioner, above and along the XY plane of the one or more first electronic substrates and relative to the first applicator to form a second fluid pattern at the second dispense region of the one or more first electronic substrates; capturing at least one image of a plurality of dispense regions provided on an XY plane of one or more second electronic substrates; selecting, from the at least one image of the one or more second electronic substrates, first and second dispense regions of the plurality of dispense regions of the one or more second electronic substrates; determining, based upon the at least one image of the one or more second electronic substrates, that the first and second dispense regions of the one or more second electronic substrates are aligned relative to one another; dispensing fluid from the first applicator while moving the first applicator, using the primary positioner, above and along the XY plane of the one or more second electronic substrates to form the first fluid pattern at the first dispense region of the one or more second electronic substrates; and dispensing fluid from the second applicator, simultaneously with the dispensing of the fluid from the first applicator, while moving the second applicator together with first applicator, using the primary positioner, above and along above the XY plane of the one or more second electronic substrates to form the second fluid pattern at the second dispense region of the one or more second electronic substrates.
 2. The method of claim 1, further comprising assigning the first applicator to the first dispense region and the second applicator to the second dispense region of the one or more first electronic substrates prior to dispensing fluid to the one or more first electronic substrates.
 3. The method of claim 1, further comprising assigning the first applicator to the first dispense region and the second applicator to the second dispense region of the one or more second electronic substrates prior to dispensing fluid to the one or more second electronic substrates.
 4. The method of claim 1, wherein determining that the first or the second dispense region of the one or more first electronic substrates is misaligned relative to the other of the first or the second dispense region of the one or more first electronic substrates comprises determining that the first or the second dispense region of the one or more first electronic substrates is rotated relative to the other of the first or the second dispense region of the one or more first electronic substrates.
 5. The method of claim 1, wherein determining that the first and the second dispense regions of the one or more second electronic substrates are aligned relative to one another comprises determining that the first and the second dispense regions of the one or more second electronic substrates are not rotated relative to one another.
 6. The method of claim 1, wherein the first fluid pattern and the second fluid pattern are substantially identical in size and shape.
 7. The method of claim 1, wherein dispensing fluid from the second applicator while moving the second applicator, using the primary positioner and the secondary positioner, to form the second fluid pattern at the second dispense region of the one or more first electronic substrates occurs subsequently and in response to determining that the first or the second dispense region of the one or more first electronic substrates is misaligned relative to the other of the first or the second dispense region of the one or more first electronic substrates.
 8. The method of claim 1, wherein dispensing fluid from the second applicator while moving the second applicator together with first applicator, using the primary positioner, to form the second fluid pattern at the second dispense region of the one or more second electronic substrates occurs subsequently and in response to determining that the first and second dispense regions are aligned relative to one another.
 9. The method of claim 1, wherein dispensing fluid from the second applicator to form the second fluid pattern at the second dispense region of the one or more second electronic substrates includes moving the second applicator together with the first applicator, using the primary positioner, in at least one of an X axis direction and a Y axis direction, which is orthogonal to the X axis direction, without providing relative movement between the first applicator and the second applicator, using the secondary positioner, in the X axis direction or the Y axis direction.
 10. The method of claim 1, wherein dispensing fluid from the second applicator to form the second fluid pattern at the second dispense region of the one or more first electronic substrates includes moving the second applicator relative to the first applicator, using the secondary positioner, in at least one of an X axis direction and a Y axis direction, which is orthogonal to the X axis direction.
 11. The method of claim 10, wherein dispensing fluid from the second applicator to form the second fluid pattern at the second dispense region of the one or more first electronic substrates includes moving the second applicator relative to the first applicator, using the secondary positioner, in both the X axis direction and the Y axis direction.
 12. The method of claim 1, wherein determining that the first or the second dispense region of the one or more first electronic substrates is misaligned relative to the other of the first or the second dispense region of the one or more first electronic substrates is based upon identifying reference fiducials associated with the first and the second dispense regions of the one or more first electronic substrates from the at least one image of the one or more first electronic substrates.
 13. The method of claim 1, wherein determining that the first and the second dispense regions of the one or more second electronic substrates are aligned relative to one another is based upon identifying reference fiducials associated with the first and the second dispense regions of the one or more second electronic substrates from the at least one image of the one or more second electronic substrates.
 14. The method of claim 1, further comprising, prior to dispensing fluid from the first applicator to form the first fluid pattern at the first dispense region of the one or more first electronic substrates and prior to dispensing fluid from the second applicator to form the second fluid pattern at the second dispense region of the one or more first electronic substrates: positioning the first applicator in the XY plane of the one or more first electronic substrates above a first dispense site at the first dispense region of the one or more first electronic substrates and simultaneously positioning the second applicator in the XY plane of the one or more first electronic substrates to position the second applicator above a first dispense site at the second dispense region of the one or more first electronic substrates.
 15. The method of claim 14, wherein: the positioning of the first applicator above the first dispense site at the first dispense region of the one or more first electronic substrates includes moving the first applicator, using the primary positioner, in at least one of an X axis direction and a Y axis direction, which is orthogonal to the X axis direction, and simultaneously positioning the second applicator above the first dispense site at the second dispense region of the one or more first electronic substrates includes moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using the secondary positioner in at least one of the X axis direction and the Y axis direction.
 16. The method of claim 1, further comprising, prior to dispensing fluid from the first applicator to form the first fluid pattern at the first dispense region of the one or more second electronic substrates and prior to dispensing fluid from the second applicator to form the second fluid pattern at the second dispense region of the one or more second electronic substrates: positioning the first applicator in the XY plane of the one or more second electronic substrates above a first dispense site at the first dispense region of the one or more second electronic substrates and simultaneously positioning the second applicator in the XY plane of the one or more second electronic substrates to position the second applicator above a first dispense site at the second dispense region of the one or more second electronic substrates.
 17. The method of claim 16, wherein: the positioning of the first applicator above the first dispense site at the first dispense region of the one or more second electronic substrates includes moving the first applicator, using the primary positioner, in at least one of an X axis direction and a Y axis direction, which is orthogonal to the X axis direction, and simultaneously positioning the second applicator above the first dispense site at the second dispense region of the one or more second electronic substrates includes moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using the secondary positioner in at least one of the X axis direction and the Y axis direction.
 18. The method of claim 1, wherein the first applicator is mounted to the primary positioner and the second applicator is mounted to the secondary positioner.
 19. The method of claim 18, wherein the secondary positioner is operatively coupled with and movable relative to the primary positioner.
 20. The method of claim 1, wherein the first applicator and the second applicator are each operatively coupled to a carriage of the primary positioner, the carriage being configured to move both the first applicator and the second applicator in at least one of an X axis direction and a Y axis direction, which is orthogonal to the X axis direction. 